Your browser doesn't support javascript. This means that the content or functionality of our website will be limited or unavailable. If you need more information about Vinnova, please contact us.

Towards Integration of Carbon Capacitors in Industrial Wafer Fabrication

Reference number
Coordinator SMOLTEK AB
Funding from Vinnova SEK 112 732
Project duration November 2020 - March 2021
Status Completed
Venture The strategic innovation programme Electronic Components and Systems:

Important results from the project

The unfortunate outcome of the project is that no consortium could be formed to apply for "smarter electronics" the call this spring. The major factors, which led to this result are the short project time, the prevailing pandemic situation and the fact that interested partners who were found identified and contacted did not eventually qualify as co-applicants to participate in the consortium that was considered to be able to apply for the “smarter electronics” calls for proposal.

Expected long term effects

Although the project did not result in forming a consortium to apply for the next call in the frame of "smartare elektronik", the project helped to broaden the awareness around CNF-MIM among end-users and to increase the possibilities for faster integration of CNF-MIM on 200 and 300 mm wafers, by establishing deeper contact with HVM CVD manufacturers and semiconductor foundries. Collaborations and interactions between Smoltek and several of such parties continue but outside the framework of "smartare elektronik".

Approach and implementation

The project focused specifically on three types of possible partners to develop a consortium for the application in the next "smarter electronics" call: foundries, process equipment manufacturers and end users of the technology. Specific substrates for demonstration of CNF growth in a CVD system at a supplier were manufactured. However, due to the Covid 19 pandemic, the demo could not be completed in time. However, the project helped to broaden the awareness around CNF-MIM among end-users and to establish deeper contact with HVM CVD manufacturers and semiconductor foundries.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 17 April 2021

Reference number 2020-03684