KDT JU 2022 RIA ARCHIMEDES
| Reference number | |
| Coordinator | STMicroelectronics Silicon Carbide AB |
| Funding from Vinnova | SEK 2 718 675 |
| Project duration | May 2023 - April 2026 |
| Status | Completed |
| Venture | Chips Joint Undertaking – an EU program to strengthen competitiveness in semiconductors |
Important results from the project
The project has generated results in the form of lower dislocation density on 200mm Silicon Carbide substrates manufactured by STM. The goal has been met, among other things, through the purchase of new analysis equipment to map dislocations over entire substrates using X-rays. The collaboration with ST Catania (a project partner) has been deepened as it is now possible to perform analyses by correlating areas with defects to electrical results in the same areas.
Expected long term effects
Long-term, this means that components based on silicon carbide can have better stability (reliability) and can be used in areas where there is currently uncertainty about the link between long-term stability and defects. The fact that these results have been achieved also means that production in Europe can continue to compete with similar operations outside the EU.
Approach and implementation
The project has had 5 different work packages, most of which have been able to proceed independently of each other. The qualification of X-ray as an analysis method took longer than expected due to the complexity of the data, but instead provided a deeper understanding of what is important for the development. The cooperation between project partners has generally worked well, but the substrate part has been partly disconnected from other parts.