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KDT JU 2021 IA HICONNECTS

Reference number
Coordinator Excillum AB
Funding from Vinnova SEK 3 000 000
Project duration January 2023 - December 2025
Status Ongoing
Venture Chips Joint Undertaking – an EU program to strengthen competitiveness in semiconductors

Purpose and goal

Excillum´s development in the project is aimed to an X-ray source prototype with 4 W of target power at 150 nm resolution and 160 kV acceleration voltage, enabling X-ray inspection system (developed by deepXscan) with higher resolution and acceptable throughput compared to today´s state of the art.

Expected effects and result

The target group of this project developments are OEMs, end users (industry and research labs) of X-ray systems ( for metrology and other applications) integrating Excillum’s X-ray source. Opening new metrology market after successful implementation of new X-ray source after this project. The Economic impact is the continued growth of the semiconductor industry by enabling further scaling through 3D heterogeneous integration using advanced packaging techniques thanks to higher precision metrology supporting the ever-growing manufacturing challenges.

Planned approach and implementation

Month 2 - HICONNECTS Kickoff meeting Month 16 - Milstolpe: X-ray source prototype ready for evaluation Month 24 - Leverans: X-ray source prototype operational

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 8 February 2023

Reference number 2022-02784