Graphene-based heat sink

Important results from the project

Heat sinks have been developed to maximize the heat exchange between electronic components and the surrounding cooling mediums. With the evolution of miniaturized electronic devices, heat transfer and cooling mechanisms have become more challenging to avoid overheating, premature failure and maximize their performance with smaller, lighter, and more efficient heat sinks. Graphene based heat sinks provide a solution to conventional copper or aluminum materials. They offer outstanding heat conductivity and lighter components.

Expected long term effects

A graphene sink prototype with high heat flux and cooling power was developed by layer by layer deposition of graphene sheet into polymer layers. Mechanical and thermal properties were measured for different graphene/polymer ratios to determine the influence of graphene content on the material performance. Simulation of the thermal analysis in steady state was also realized for the heat sink prototype. The prototype here developed represents a solution for lightweight and superior thermal conductivity for application in the electronic field.

Approach and implementation

The market for cooling modules in electronics is estimated to continue growing therefore efficient materials and components need to be developed. For further implementation of the prototype here developed it would be necessary to introduce thermal interface materials between the electronic device, the heat spreader, and the heat sink. Furthermore, tests on real modules from aeronautic and/or automotive applications should be performed as well as determine the reliability and long term performance of graphene based heat sinks.