Efficient mmW Backhaul for enhanced wideband Connectivity
| Reference number | |
| Coordinator | Chalmers Tekniska Högskola AB - Chalmers Tekniska Högskola Inst f Mikroteknologi & nanovetensk |
| Funding from Vinnova | SEK 4 000 000 |
| Project duration | July 2022 - December 2024 |
| Status | Completed |
| Venture | The strategic innovation programme Electronic Components and Systems: |
| Call | Electronic components & systems - research and innovation projects 2022 |
Important results from the project
The project was very successful as it initiated a new level of collaboration between Ericsson, Gotmic and Chalmers in the area of efficiency enhanced E- and D-Band amplifiers. Here significant progress was made in the area of circuit design and transistor modelling and two reticles were taped out in a commercial 100nm GaAs process. Further work in low-cost, high-performance packaging, interconnects, and chip integration lead to a conference publication.
Expected long term effects
The project is going to strengthen the participating players in terms of competitiveness in an international market and will help improve the energy efficiency of wireless backhauling solutions of the future. This will lead to a more sustainable telecommunication infrastructure (particularly in backhauling) and reduce costs for the consumers.
Approach and implementation
The project consortium met on a monthly basis to discuss the status and align between project partners, which worked very well. The time plan from the proposal could be followed mostly, with some initial delays at Chalmers due to the hiring process of a Ph.D. student. The project plan also had to be adopted slightly for the tape-out schedule form WIN Semiconductors, which generously provided manufacturing capabilities free of charge.