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Efficient mmW Backhaul for enhanced wideband Connectivity

Reference number
Coordinator Chalmers Tekniska Högskola AB - Chalmers Tekniska Högskola Inst f Mikroteknologi & nanovetensk
Funding from Vinnova SEK 4 000 000
Project duration July 2022 - December 2024
Status Ongoing
Venture The strategic innovation programme Electronic Components and Systems:
Call Electronic components & systems - research and innovation projects 2022

Purpose and goal

The purpose of the EMBRACE project is to enable the transition of microwave backhauling solutions to higher frequencies, using efficient power amplifiers and intelligent integration solutions to produce 100mW to 1W of microwave radio power at E-band (71-86 GHz) and D-band (130-165 GHz) frequencies.

Expected effects and result

First demonstration of Supply modulated PA above 100 GHz for increased back-off efficiency. Fist D-band PA exceeding > 100mW of output power in economical 100nm GaAs HEMT process.

Planned approach and implementation

A Swedish team of experts found at Ericsson, Gotmic and Chalmers will design amplifier chips that can deliver the required power at these bands efficiently by employing innovative chip design, efficiency boosting techniques (supply modulation) and compact low-loss packaging. At E-band we will at least double the efficiency from the state of the art for modulated signals. At D-band we will implement a PA chip in GaAs technology that efficiently produces at least 100mW of saturated output, which will be a world record in this economical technology.

The project description has been provided by the project members themselves and the text has not been looked at by our editors.

Last updated 8 March 2024

Reference number 2022-00861