Compact Millimeter Wave Integration Concept for Future Wireless and Sensor Systems

Purpose and goal

In this project, Ericsson, SAAB and Chalmers have investigated a new integration concept for future multi-antenna mm-wave systems. The concept allows for a compact and high performance integration of gallium nitride, silicon CMOS and planar group antennas. During the project, the original concept was refined and experimentally verified through prototypes. The project has resulted in a new understanding of electrical-mechanical and thermal effects interact and can be managed, which lays the foundation for further research and development towards future wireless systems.

Expected effects and result

The integration concepts in today´s communication and sensor systems cannot easily be adapted to the requirements of mm-wave / multi-antenna applications. The vertical integration concept developed in the project shows a possible way of combining high power generation and high electrical performance up to mm wave frequencies. Although the concept cannot be directly applied to existing products, the accumulated knowledge and technical processes are of crucial importance in the development of both current and future highly integrated communication and sensor systems.

Planned approach and implementation

In the project, we utilized the parties´ unique background in integrated GaN processes and measurement technology for high power components (Chalmers), production processes for mm-wave frequencies (Ericsson) and testing of large antenna systems (Saab). Through intense collaboration we have been able to experimentally and theoretically understand the limits of the proposed concpet. The project has, more than originally anticipated, brought together interdisciplinary competencies within and between the project partners. New projects will build on these new collaborations.