Aros Graphene based thermal interface materials

Important results from the project

Cooling of modern electronics is often done by a soft compressible material replacing air between component and heat sink. For more compact products, the heat conduction on this material needs to increase. The main goal of the project has been to investigate how Aros Graphene® can be used to improve the thermal conductivity of these materials. This has been done by using both Graphene powder and in combination with other fillers in a silicone matrix. By gradually increasing the complexity of the mixtures, an understanding is gained on how Graphene’s thermal conductivity is best utilized.

Expected long term effects

Graphene is the material with the highest thermal conductivity of all and expected results has been an improved thermal conduction of compound compared to the use of traditional fillers. In the project we have found the suitable type of graphene for thermal applications, and that the Aros Graphene® process gives good dispersion. Graphene as an additive gave increase in heat conduction in mixtures by about 40%. We have not reached the main goal of demonstrating a thermal interface material of 30W/mK, but the results of ~ 20W/mK are already commercially interesting.

Approach and implementation

The project has been carried out as a collaboration between Nolato, Graphmatech and Ericsson. Graphmatech, with its patented Aros Graphene® process, has prepared graphene raw materials and functionalized particles. Nolato has prepared and characterized heat conducting mixtures. Ericsson has specified product and tested materials. Initially, simple systems with 1-2 fillers in a silicone matrix were studied to understand the basic thermal properties. Subsequently, high conductive mixtures have been formulated with higher filler ratio and necessary mechanical properties.